Laminated foil structure and method of forming the same
AssigneeLinxens Holding
InventorCarsten Nieland
Life of this patent
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Abstract
When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.
Claims9
A method of forming a laminated foil layer stack, the method comprising:
- providing a first foil layer including a layer portion with a contact area having formed thereon a solder material,
- positioning a second foil layer adjacent to said first foil layer so as to form a layer stack, said second foil layer having an opening extending through the second foil layer and exposing said solder material,
- defining an area of increased pressure locally in said second foil layer, said area of increased pressure laterally surrounding said opening, and
- applying pressure and heat to said first and second foil layers so as to build up increased pressure in said area of increased pressure, and laminate said second foil layer to said first foil layer with said area of increased pressure laterally confining said solder material.
Dependencies are inferred from the claim text.