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US 11,758,646 B2Granted
Antenna module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJae Woong Choi, Jin Won Lee
Life of this patent
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Abstract
An antenna module includes a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; an antenna disposed on an upper surface of the wiring structure; a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure; and an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure.
Claims14
An antenna module, comprising:
- a wiring structure including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers;
- an antenna disposed on an upper surface of the wiring structure;
- a heat dissipation structure disposed around the antenna on the upper surface of the wiring structure;
- and
- an encapsulant disposed on the upper surface of the wiring structure and covering at least a portion of each of the antenna and the heat dissipation structure,
- wherein at least a portion of an uppermost wiring layer of the plurality of wiring layers is connected to the antenna through a first connection via of an uppermost via layer of the plurality of via layers, and
- wherein the first connection via penetrates at least a portion of the encapsulant.
4 more elements
Dependencies are inferred from the claim text.