Silica glass member for hermetic sealing of ultraviolet SMD LED element and method for manufacturing quartz glass member for ultraviolet led

An ultraviolet SMD LED element package comprising:

• a silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 200 nm to 400 nm, in particular from 250 nm to 350 nm, and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate comprises:
• a first surface on an inside opposed to the SMD LED element;
• and
• a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens-like convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein the silica glass member for hermetic sealing has an internal transmittance at a thickness of 3 mm of 95% to 99% for ultraviolet light having a wavelength of 300 nm to 400 nm and an internal transmittance at a thickness of 3 mm of 92% to 99% for ultraviolet light having a wavelength of 245 nm or more and less than 300 nm.

A silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 250 nm to 350 nm and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising:

• a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has:
• a first surface on an inside opposed to the SMD LED element;
• and
• a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein the silica glass member for hermetic sealing has an internal transmittance at a thickness of 3 mm of 95% to 99% for ultraviolet light having a wavelength of 300 nm to 400 nm and an internal transmittance at a thickness of 3 mm of 92% to 99% for ultraviolet light having a wavelength of 245 nm or more and less than 300 nm.

A silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 250 nm to 350 nm and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising:

• a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has:
• a first surface on an inside opposed to the SMD LED element;
• and
• a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein respective differences between internal transmittances of the silica glass member for hermetic sealing at a thickness of 3 mm for ultraviolet light having wavelengths of 350 nm, 300 nm, and 250 nm measured using an integrating sphere and internal transmittances thereof at a thickness of 3 mm for ultraviolet light having wavelengths of 350 nm, 300 nm, and 250 nm in general measurement are each within 0.5%.

A silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 250 nm to 350 nm and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic scaling comprising:

• a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has:
• a first surface on an inside opposed to the SMD LED element;
• and
• a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein bubbles contained in the silica glass member for hermetic sealing each has a diameter equal to 50 μm or less, and the bubbles contained have a total cross-sectional area equal to 1×10−3 mm2 or less per 0.1 cm3 of a volume of the silica glass member for hermetic sealing.

A silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 250 nm to 350 nm and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising:

• a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has:
• a first surface on an inside opposed to the SMD LED element;
• and
• a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein the silica glass member for hermetic sealing contains OH groups at a concentration of 0.1 ppm to 20 ppm.