Articles having diamond-only contact surfaces

A semiconductor wafer handling article, comprising:

• a surface configured to support a semiconductor wafer, said wafer support surface including a composite material that includes a matrix component and a reinforcement component including diamond particulate distributed throughout said matrix component,
• wherein said matrix component has a recessed or relieved surface, leaving diamond particles of said diamond particulate standing proud relative to the recessed or relieved surface of the matrix component, such that all wafer contact is with said diamond particles, and
• wherein said matrix component comprises reaction bonded silicon carbide,
• wherein the matrix component is electrical discharge machinable,
• wherein the semiconductor wafer handling article is selected from the group consisting of vacuum wafer chuck, electrostatic chuck, vacuum wafer table, wafer arm, and susceptor,
• wherein the diamond particles have flattops with rounded edges formed by lapping, wherein the flattops are configured to support the semiconductor wafer, and wherein the flat tops of the diamond particles have a common elevation.