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US 11,750,170 B2Granted
Guided SAW device
AssigneeQorvo US, Inc.
InventorsShogo Inoue, Marc Solal
Life of this patent
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Abstract
A guided surface acoustic wave (SAW) device includes a substrate, a piezoelectric layer on the substrate, and a transducer on the piezoelectric layer. The substrate is silicon, and has a crystalline orientation defined by a first Euler angle (ϕ), a second Euler angle (θ), and a third Euler angle (ψ). The first Euler angle (ϕ), the second Euler angle (θ), and the third Euler angle (ψ) are chosen such that a velocity of wave propagation within the substrate is less than 6,000 m/s.
Claims22
A guided surface acoustic wave (SAW) device comprising:
- a silicon substrate having a crystalline orientation defined by a first Euler angle (ϕ), a second Euler angle (θ), and a third Euler angle (ψ), wherein the first Euler angle (ϕ), the second Euler angle (θ), and the third Euler angle (ψ) such that a velocity of wave propagation within the substrate is less than 6,000 m/s;
- a piezoelectric layer on the silicon substrate;
- and
- a transducer on the piezoelectric layer.
1 more element
Dependencies are inferred from the claim text.