Package with a substrate comprising periphery interconnects
AssigneeQUALCOMM Incorporated
InventorsAniket Patil, Hong Bok We
Life of this patent
Estimating the term…
Abstract
A package comprising a substrate, a first integrated device and a second integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects, a solder resist layer, and a plurality of periphery interconnects located over the solder resist layer. The first integrated device is coupled to the substrate. The second integrated device is coupled to the substrate. The second integrated device is configured to be electrically coupled to the first integrated device through the plurality of periphery interconnects.
Claims23
A package comprising:
- a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects;
- a solder resist layer;
- and
- a plurality of periphery interconnects located over the solder resist layer;
- a first integrated device coupled to the substrate;
- and
- a second integrated device coupled to the substrate, wherein the second integrated devices is configured to be electrically coupled to the first integrated device through the plurality of periphery interconnects.
An apparatus comprising:
- a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects;
- a solder resist layer;
- and
- means for periphery interconnection located over the solder resist layer;
- a first integrated device coupled to the substrate;
- and
- a second integrated device coupled to the substrate, wherein the second integrated devices is configured to be electrically coupled to the first integrated device through the means for periphery interconnection.
A method for fabricating a package, comprising:
- providing a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects;
- a solder resist layer;
- and
- a plurality of periphery interconnects located over the solder resist layer;
- coupling a first integrated device to the substrate;
- and
- coupling a second integrated device to the substrate, wherein the second integrated devices is configured to be electrically coupled to the first integrated device through the plurality of periphery interconnects.
Dependencies are inferred from the claim text.