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US 11,747,728 B2Granted
Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resin
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsJunya Horiuchi, Yu Okada, Takashi Makinoshima, Masatoshi Echigo
Life of this patent
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Abstract
An object of the present invention is to provide a new compound that is useful as a film forming material for lithography and the like. The above object can be achieved by a compound represented by the following formula (1).
Claims18
A compound represented by the following formula (1):
- wherein
- A is a group having 1 to 12 carbon atoms;
- R1 is a 2n-valent group having 1 to 30 carbon atoms;
- R2 to R5 are each independently a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, a thiol group, or a hydroxyl group;
- at least one R4 and/or at least one R5 is a hydroxy group and/or a thiol group;
- m2 and m3 are each independently an integer of 0 to 8;
- m4 and m5 are each independently an integer of 0 to 9;
- n is an integer of 1 to 4;
- and
- p2 to p5 are each independently an integer of 0 to 2.
7 more elements
Dependencies are inferred from the claim text.