Superomniphobic, flexible and rigid substrates with high transparency and adjustable haze for optoelectronic application

A method of fabricating a superomniphobic structure, comprising:

• obtaining a substrate selected from the group consisting of a rigid substrate and a flexible substrate, having a top surface and a bottom surface;
• forming a sub-wavelength, nanostructured texture comprising a reentrant structure on at least one of the top surface and the bottom surface of the substrate, the texture comprising:
• a plurality of nanostructures comprising polymer, selected from the group consisting of needle, blade, and combinations thereof;
• a distance between each of the nanostructures from about 100 nm to about 700 nm;
• a height of the plurality of nanostructures in a range from about 1 μm to about 35 μm to produce simultaneously high haze and high transparency, or a height of the plurality of nanostructures in a range from about 100 nm to about 800 nm to produce simultaneous low haze and high transparency,
• wherein the height of each individual reentrant structure is substantially consistent as compared to the other reentrant structures,
• wherein the haze is adjustable from 0.1% to greater than 90% based on the height of the plurality of nanostructures,
• wherein the distance between each of the reentrant structures is substantially consistent;
• applying a silicon dioxide coating to the sub-wavelength, nanostructured texture;
• and
• depositing a low surface energy material on the silicon dioxide coating,
• wherein the high haze corresponds to a haze factor of greater than 70% and the low haze corresponds to a haze factor of less than 5%, and
• wherein the high transparency corresponds to a total transmission of greater than 80%.