Compound, resin composition and laminated substrate thereof
AssigneeIndustrial Technology Research Institute
InventorsJyh-Long Jeng, Jeng-Yu Tsai, Wei-Ta Yang
Life of this patent
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Abstract
A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.
Claims15
A resin composition, comprising:
- a compound, wherein the compound has a structure represented by Formula (I):
- wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group;
- A2 can be C2-12 alkylene group, C6-25 arylene group, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group;
- and, n≥1;
- and
- an anhydride, wherein the anhydride comprises monoanhydride, dianhydride, or a combination thereof.
Dependencies are inferred from the claim text.