Multi-component composition for producing an aqueous coating mass

A method for the production of a hydraulically cured enclosure of an electronic component, the method comprising the steps of:

• (i) providing an electronic component to be enclosed;
• (ii) providing an aqueous enclosing mass in the form of an aqueous hydraulically curable preparation produced according to a method comprising the steps of:
• mixing at least one component of a composition with water to produce at least one aqueous intermediate, and
• mixing the at least one aqueous intermediate with further component(s) of the composition and/or further aqueous intermediate(s),
• wherein the composition consists of the following constituents:
• (a) 1 to 30 wt. % of at least one hydrogen phosphate selected from the group consisting of mono and dihydrogen phosphates of magnesium, calcium, aluminum, zinc, iron, cobalt, and copper;
• (b) 1 to 40 wt. % of at least one compound selected from the group consisting of oxides, hydroxides, and oxide hydrates of magnesium, calcium, iron, zinc, and copper;
• (c) 40 to 95 wt. % of at least one particulate filling agent selected from the group consisting of glass;
• mono-, oligo- and poly-phosphates of magnesium, calcium, barium and aluminum;
• calcium sulfate;
• barium sulfate;
• simple and complex silicates comprising sodium, potassium, calcium, aluminum, magnesium, iron and/or zirconium;
• simple and complex aluminates comprising sodium, potassium, calcium, magnesium and/or zirconium;
• simple and complex titanates comprising sodium, potassium, calcium, aluminum, magnesium, barium and/or zirconium;
• simple and complex zirconates comprising sodium, potassium, calcium, aluminum and/or magnesium;
• zirconium dioxide;
• titanium dioxide;
• aluminum oxide;
• silicon dioxide;
• silicon carbide;
• aluminum nitride;
• boron nitride and silicon nitride;
• and
• (d) 0 to 25 wt. % of at least one constituent that differs from constituents (a) to (c),
• wherein constituents (a), (b) and (c) comprise no free water,
• wherein constituent (d) comprises no water,
• wherein the composition is present as a two-component system, and
• wherein constituents (a) and (b) are present separate from each other before the mixing steps;
• (iii) enclosing the electronic component provided in step (i) in the aqueous enclosing mass provided in step (ii);
• and
• (iv) hydraulic curing the aqueous enclosing mass enclosing the electronic component after completion of step (iii).