Back to results
US 11,745,281 B2Granted
Solder removal from semiconductor devices
AssigneeMicron Technology, Inc.
InventorMark E. Tuttle
Life of this patent
Estimating the term…
Abstract
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Claims20
A solder removal apparatus, comprising:
- a plurality of solder-interfacing protrusions extending from a body along a first axis, each of the plurality of solder-interfacing protrusions configured to remove a corresponding one of a plurality of solder features from a semiconductor device, each of the plurality of solder features having an amount of solder material,
- wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has surface-area increasing features sufficient to support the amount of solder material of the corresponding one of the plurality of solder features,
- wherein the surface area-increasing features comprise one or more annular ridges or depressions that increase a surface area of the at least one of the plurality of solder-interfacing protrusions relative to a smooth cylindrical pin displacing a same volume,
- wherein cross-sections of the one or more annular ridges or depressions are circular along a plane having a normal vector defined by the first axis.
1 more element
A solder removal apparatus, comprising:
- a body;
- a plurality of solder-interfacing protrusions extending from the body along a first axis;
- and
- a resistive heater operably coupled to the plurality of solder-interfacing protrusions,
- wherein each of the plurality of solder-interfacing protrusions is configured to mechanically interface with a corresponding one of a plurality of solder features on a semiconductor device, and
- wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has a plurality of vertical ridges or depressions such that a surface area of the at least one of the plurality of solder-interfacing protrusions is sufficient to wick away substantially all of the corresponding one of the plurality of solder feature,
- wherein the plurality of vertical ridges or depressions extend along second axes parallel with the first axis.
4 more elements
A solder removal apparatus, comprising:
- a body;
- and
- a plurality of solder-interfacing protrusions extending from the body along a first axis;
- wherein each of the plurality of solder-interfacing protrusions is configured to be inserted into a corresponding one of a plurality of solder features on a semiconductor device, and
- wherein an outer surface of at least one of the plurality of solder-interfacing protrusions has a plurality of annular ridges or depressions such that a surface area of the at least one of the plurality of solder-interfacing protrusions is sufficient to support substantially all of an amount of solder material of the corresponding one of the plurality of solder features,
- wherein cross-sections of the one or more annular ridges or depressions are circular along a plane having a normal vector defined by the first axis.
3 more elements
Dependencies are inferred from the claim text.