Use of an electric field for detaching a piezoelectric layer from a donor substrate
AssigneeSoitec
InventorCédric Charles-Alfred
Life of this patent
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Abstract
A method for transferring a piezoelectric layer from a donor substrate onto a support substrate comprises the steps of: a) providing a predetermined splitting area in a piezoelectric donor substrate, b) attaching the piezoelectric donor substrate to a support substrate to form an assembly, and c) detaching the piezoelectric layer from the piezoelectric donor substrate comprising applying an electric field. By using the electric field, the detachment step can be carried out at low temperatures. A detachment chamber for carrying out at least a portion of such a method includes one or two chucks comprising first and/or second electrodes for applying an electric field to a piezoelectric layer.
Claims20
A method of transferring a piezoelectric layer onto a support substrate, comprising the steps of:
- a) providing a predetermined splitting area in a piezoelectric donor substrate, the predetermined splitting area delimiting a piezoelectric layer to be transferred;
- b) attaching the piezoelectric donor substrate to the support substrate to form an assembly, the piezoelectric layer adjacent to the support substrate;
- and
- c) detaching the piezoelectric layer from the piezoelectric donor substrate, wherein detaching the piezoelectric layer comprises applying an electric field at a temperature of less than 100° C.
A method of transferring a piezoelectric layer onto a support substrate, comprising the steps of:
- a) providing a predetermined splitting area in a piezoelectric donor substrate, the predetermined splitting area delimiting a piezoelectric layer to be transferred;
- b) attaching the piezoelectric donor substrate to the support substrate to form an assembly, the piezoelectric layer adjacent to the support substrate;
- and
- c) detaching the piezoelectric layer from the piezoelectric donor substrate, wherein detaching the piezoelectric layer comprises placing a surface of the piezoelectric donor substrate of the assembly in direct contact with a chuck, the chuck comprising interdigitated electrodes separated by an electrically insulating material, and applying an electric field using the chuck.
A method of transferring a piezoelectric layer onto a support substrate, comprising the steps of:
- a) providing a predetermined splitting area in a piezoelectric donor substrate, the predetermined splitting area delimiting a piezoelectric layer to be transferred;
- b) attaching the piezoelectric donor substrate to the support substrate to form an assembly, the piezoelectric layer adjacent to the support substrate;
- and
- c) detaching the piezoelectric layer from the piezoelectric donor substrate, wherein detaching the piezoelectric layer comprises applying an electric field using a chuck comprising at least one electrode, wherein the assembly is sandwiched between the chuck and a second electrode.
Dependencies are inferred from the claim text.