US 11,742,233 B2 · Method of mechanical separation for a double layer transfer

Abstract

The present disclosure relates to a method for mechanically separating layers, in particular in a double layer transfer process. The present disclosure relates more in particular to a method for mechanically separating layers, comprising the steps of providing a semiconductor compound comprising a layer of a handle substrate and an active layer with a front main side and a back main side opposite the front main side, wherein the layer of the handle substrate is attached to the front main side of the active layer, then providing a layer of a carrier substrate onto the back main side of the active layer, and then initiating mechanical separation of the layer of the handle substrate, wherein the layer of the handle substrate and the layer of the carrier substrate are provided with a substantially symmetrical mechanical structure.

Claims12

Dependent claims

A wafer structure, comprising:

a first substrate;
a layer of a first material attached to the first substrate;
and
a second substrate attached to the layer of the first material such that the layer of the first material is disposed between the first substrate and the second substrate;
and
wherein the wafer structure has a substantially symmetrical mechanical structure relative to the layer of the first material;
and
wherein the first substrate has a first thickness and the second substrate has a second thickness different from the first thickness, or a second material of the first substrate exhibits a first Young's modulus and a third material of the second substrate exhibits a second Young's modulus different from the first Young's modulus.

5 more elements

Dependencies are inferred from the claim text.

Method of mechanical separation for a double layer transfer

Life of this patent

Method of mechanical separation for a double layer transfer

Life of this patent

Abstract

Claims12