Small-area side-capacitor read-only memory device, memory array and method for operating the same

A small-area side-capacitor read-only memory array comprising:

• parallel bit lines classified into a plurality of groups, wherein the plurality groups of the bit lines comprise a first group bit line and a second group bit line;
• parallel word lines, arranged perpendicular to the bit lines, comprising a first word line;
• parallel common source lines, arranged parallel to the word lines, comprising a first common source line;
• and
• sub-memory arrays, wherein each of the sub-memory arrays, connected to two groups of the bit lines, the word line, and the common source line, comprises:
• a first memory cell connected to the first group bit line, the first common source line, and the first word line;
• a second memory cell connected to the second group bit line, the first common source line, and the first word line, wherein the first memory cell and the second memory cell are arranged to be symmetric to each other and located at a same side of the first common source line;
• a third memory cell connected to the first group bit line, the first common source line, and the first word line and arranged to be symmetric to the first memory cell with the first common source line as an axis;
• and
• a fourth memory cell connected to the second group bit line, the first common source line, and the first word line and arranged to be symmetric to the second memory cell with the first common source line as an axis, wherein the third memory cell and the fourth memory cell are arranged to be symmetric to each other and located at a same side of the first common source line, the first memory cell and the third memory cell are respectively located at two different sides of the first common source line, and each of the first memory cell, the second memory cell, the third memory cell, and the fourth memory cell includes a field-effect transistor and a capacitor that are formed in a semiconductor substrate;
• wherein the field-effect transistor comprises a first dielectric layer, a first conductive gate, and first ion-doped areas, the first dielectric layer is formed on a surface of the semiconductor substrate, the first conductive gate is stacked on the first dielectric layer, the first ion-doped areas are formed in the semiconductor substrate under regions that are arranged at two sides of the first conductive gate, and the first ion-doped areas are respectively used as a source and a drain;
• wherein the capacitor comprises a second dielectric layer, a second conductive gate, and a second ion-doped area, the second dielectric layer is formed on a surface of the semiconductor substrate, the second conductive gate is connected to the first conductive gate and stacked on the second dielectric layer, the second ion-doped area and the first ion-doped areas are doped with ions that have a same conductivity type, the second ion-doped area is formed at a side of the second dielectric layer, the second conductive gate has a strip portion and parallel finger portions, and one end of each of the finger portions, connected to the strip portion, extends outward from the strip portion.

A method for operating a small-area side-capacitor read-only memory array, wherein the small-area side-capacitor read-only memory array comprises parallel bit lines classified into a plurality of groups, wherein the plurality groups of the bit lines comprise a first group bit line and a second group bit line;

• parallel word lines, arranged perpendicular to the bit lines, comprising a first word line;
• parallel common source lines, arranged parallel to the word lines, comprising a first common source line;
• and sub-memory arrays, wherein each of the sub-memory arrays, connected to two groups of the bit lines, the word line, and the common source line, comprises:
• a first memory cell connected to the first group bit line, the first common source line, and the first word line;
• a second memory cell connected to the second group bit line, the first common source line, and the first word line, wherein the first memory cell and the second memory cell are arranged to be symmetric to each other and located at a same side of the first common source line;
• a third memory cell connected to the first group bit line, the first common source line, and the first word line and arranged to be symmetric to the first memory cell with the first common source line as an axis;
• and a fourth memory cell connected to the second group bit line, the first common source line, and the first word line and arranged to be symmetric to the second memory cell with the first common source line as an axis, wherein the third memory cell and the fourth memory cell are arranged to be symmetric to each other and located at a same side of the first common source line, the first memory cell and the third memory cell are respectively located at two different sides of the first common source line, and each of the first memory cell, the second memory cell, the third memory cell, and the fourth memory cell comprises an N-type field-effect transistor and a capacitor that are formed in a semiconductor substrate;
• wherein the N-type field-effect transistor comprises a first dielectric layer, a first conductive gate, and first ion-doped areas, the first dielectric layer is formed on a surface of the semiconductor substrate, the first conductive gate is stacked on the first dielectric layer, the first ion-doped areas are formed in the semiconductor substrate under regions that are arranged at two sides of the first conductive gate, and the first ion-doped areas are respectively used as a source and a drain;
• wherein the capacitor comprises a second dielectric layer, a second conductive gate, and a second ion-doped area, the second dielectric layer is formed on a surface of the semiconductor substrate, the second conductive gate is connected to the first conductive gate and stacked on the second dielectric layer, the second ion-doped area and the first ion-doped areas are doped with ions that have a same conductivity type, the second ion-doped area is formed at a side of the second dielectric layer, the second conductive gate has a strip portion and parallel finger portions, and one end of each of the finger portions, connected to the strip portion, extends outward from the strip portion;
• wherein the first memory cell, the second memory cell, the third memory cell and the fourth memory cell all function as operation memory cells, and in operating all the operation memory cells, the method is characterized in that a substrate voltage Vsub is applied to the semiconductor substrate, which is connected to all the operation memory cells, that a bit voltage Vb, a word voltage Vw and a common source voltage Vs are respectively applied to the bit lines, the word lines and the common source lines, which are connected to all the operation memory cells, that in writing, following conditions are satisfied:
• Vsub is grounded;
• Vs=Vb=0;
• and
• Vw=HV (High Voltage);
• and
• that in erasing, following conditions are satisfied:
• Vsub is grounded;
• Vs=Vb=HV;
• and
• Vw is floating.

A method for operating a small-area side-capacitor read-only memory array, wherein the small-area side-capacitor read-only memory array comprises parallel bit lines classified into a plurality of groups, wherein the plurality groups of the bit lines comprise a first group bit line and a second group bit line;

• parallel word lines, arranged perpendicular to the bit lines, comprising a first word line;
• parallel common source lines, arranged parallel to the word lines, comprising a first common source line;
• and sub-memory arrays, wherein each of the sub-memory arrays, connected to two groups of the bit lines, the word line, and the common source line, comprises:
• a first memory cell connected to the first group bit line, the first common source line, and the first word line;
• a second memory cell connected to the second group bit line, the first common source line, and the first word line, wherein the first memory cell and the second memory cell are arranged to be symmetric to each other and located at a same side of the first common source line;
• a third memory cell connected to the first group bit line, the first common source line, and the first word line and arranged to be symmetric to the first memory cell with the first common source line as an axis;
• and a fourth memory cell connected to the second group bit line, the first common source line, and the first word line and arranged to be symmetric to the second memory cell with the first common source line as an axis, wherein the third memory cell and the fourth memory cell are arranged to be symmetric to each other and located at a same side of the first common source line, the first memory cell and the third memory cell are respectively located at two different sides of the first common source line, and each of the first memory cell, the second memory cell, the third memory cell, and the fourth memory cell comprises a P-type field-effect transistor and a capacitor that are formed in a semiconductor substrate;
• wherein the P-type field-effect transistor comprises a first dielectric layer, a first conductive gate, and first ion-doped areas, the first dielectric layer is formed on a surface of the semiconductor substrate, the first conductive gate is stacked on the first dielectric layer, the first ion-doped areas are formed in the semiconductor substrate under regions that are arranged at two sides of the first conductive gate, and the first ion-doped areas are respectively used as a source and a drain;
• wherein the capacitor comprises a second dielectric layer, a second conductive gate, and a second ion-doped area, the second dielectric layer is formed on a surface of the semiconductor substrate, the second conductive gate is connected to the first conductive gate and stacked on the second dielectric layer, the second ion-doped area and the first ion-doped areas are doped with ions that have a same conductivity type, the second ion-doped area is formed at a side of the second dielectric layer, the second conductive gate has a strip portion and parallel finger portions, and one end of each of the finger portions, connected to the strip portion, extends outward from the strip portion;
• wherein the first memory cell, the second memory cell, the third memory cell and the fourth memory cell all function as operation memory cells, and in operating all the operation memory cells, the method is characterized in that a substrate voltage Vsub is applied to the semiconductor substrate, which is connected to all the operation memory cells, that a bit voltage Vb, a word voltage Vw and a common source voltage Vs are respectively applied to the bit lines, the word lines and the common source lines, which are connected to all the operation memory cells, that in writing, following conditions are satisfied:
• Vsub=HV (High Voltage);
• Vs=Vb=HV;
• and
• Vw=0;
• and
• that in erasing, following conditions are satisfied:
• Vsub=HV (High Voltage);
• Vs=Vb=0;
• and
• Vw is floating.