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US 11,739,215 B2Granted
Photosensitive resin composition
AssigneeZeon Corporation
InventorTakaaki Sakurai
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Abstract
Disclosed are photosensitive resin compositions capable of forming positive resin films with excellent heat shape retention. The photosensitive resin compositions comprises a polymer having a monomer unit represented by the following general formula (I) and a polyamideimide: where R1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent.
Claims7
A photosensitive resin composition comprising:
- a polyamideimide having a branched structure,
- a polymer that is different from the polyamideimide and has a monomer unit represented by the following general formula (I);
- where R1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent,
- a photoactive compound, and
- a cross-linker, wherein
- a content ratio by mass of the polymer to the polyamideimide (polymer:polyamideimide) is 90:10 to 70:30.
3 more elements
A photosensitive resin composition comprising:
- a polyamideimide having a branched structure, and
- a polymer that is different from the polyamideimide and has a monomer unit represented by the following general formula (I);
- where R1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent, wherein
- the polymer is a copolymer further having a (meth)acrylate monomer unit.
1 more element
Dependencies are inferred from the claim text.