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US 11,737,154 B2Granted
Patch on interposer package with wireless communication interface
AssigneeIntel Corporation
InventorTelesphor Kamgaing
Life of this patent
Estimating the term…
Abstract
A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.
Claims20
An integrated circuit die package comprising:
- an interposer;
- a first patch attached directly to the interposer;
- an integrated circuit die attached directly to the first patch;
- a second patch attached directly to the interposer, the second patch separate and distinct from the first patch;
- and
- a radio die attached directly to the second patch and coupled to the integrated circuit die through the interposer to communicate data between the integrated circuit die and an external component.
3 more elements
A computing system comprising:
- a system board;
- a central processing unit (CPU);
- an interposer as a package substrate mounted to the system board to carry the CPU, the CPU being mounted directly to a patch attached directly to the interposer, the package substrate having conductive connectors to connect the CPU to external components;
- a radio mounted directly to a radio patch attached directly to the interposer coupled to the CPU through the interposer to modulate the data onto a carrier and to transmit the modulated data to an external component, wherein the radio patch is separate and distinct from the patch;
- and
- a chipset carried by the system board coupled through the system board to the integrated circuit chip through the package.
3 more elements
An apparatus comprising:
- an interposer;
- an organic multilayer patch attached directly to a central area of the interposer;
- a central processing unit attached directly to the organic patch;
- an inorganic multilayer patch attached directly to an edge of the interposer, the inorganic multi-layer patch separate and distinct from the organic multilayer patch;
- and
- a plurality of radio dies attached directly to the inorganic patch and coupled to the central processing unit through the interposer to communicate data between the central processing unit and an external component.
3 more elements
Dependencies are inferred from the claim text.