Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorAkihiro Tanaka
Life of this patent
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Abstract
A semiconductor device includes a semiconductor part including a first surface, a second surface, a first region provided between the first surface and the second surface, and a second region provided between the first surface and the second surface; a common electrode provided at the second surface; a first electrode provided on the first surface at the first region; a second electrode provided on the first surface at the second region and separated from the first electrode; a first control electrode provided in the first region; and a second control electrode provided in the second region. A first trench is provided in the common electrode.
Claims19
A semiconductor device, comprising:
- a semiconductor part including a first surface, a second surface, a first region provided between the first surface and the second surface, and a second region provided between the first surface and the second surface;
- a common electrode provided at the second surface, the common electrode being a metal electrode, the common electrode comprising a third surface and a fourth surface, the third surface being in contact with the second surface, the fourth surface opposing the third surface;
- a first electrode provided on the first surface at the first region;
- a second electrode provided on the first surface at the second region and separated from the first electrode;
- a first control electrode provided in the first region, the first control electrode controlling a current flowing in the first region in a direction connecting the first electrode and the common electrode;
- and
- a second control electrode provided in the second region, the second control electrode controlling a current flowing in the second region in a direction connecting the second electrode and the common electrode,
- a plurality of first trenches each extending in a first direction through the common electrode,
- the plurality of first trenches dividing the common electrode into separate sections in a second direction orthogonal to the first direction,
- the semiconductor part not being provided in the plurality of first trenches,
- a density of the plurality of first trenches in the second direction at an end portion of the device being greater than a density of the plurality first trenches in the second direction at a central portion of the device.
A semiconductor device, comprising:
- a semiconductor part including a first surface, a second surface, a first region provided between the first surface and the second surface, and a second region provided between the first surface and the second surface;
- a common electrode provided at the second surface;
- a first electrode provided on the first surface at the first region;
- a second electrode provided on the first surface at the second region and separated from the first electrode;
- a first control electrode provided in the first region, the first control electrode controlling a current flowing in the first region in a direction connecting the first electrode and the common electrode;
- and
- a second control electrode provided in the second region, the second control electrode controlling a current flowing in the second region in a direction connecting the second electrode and the common electrode,
- the first electrode including a first metal portion contacting the first surface, and a second metal portion provided on the first metal portion,
- a surface area of the first metal portion being greater than a surface area of the second metal portion,
- the second metal portion being provided in a first trench that extends through the first metal portion and divides the first metal portion into separate sections.
Dependencies are inferred from the claim text.