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US 11,724,463 B2Granted
Method for the inspection of bonding patterns of packages for products
AssigneeFameccanica.Data S.p.A.
InventorAnselmo Cicchitti
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Abstract
A non-destructive, non-invasive method for inspection of bonding patterns of packages for products, such as patches or medicated patches, involves thermally probing the packages and the bonding patterns and retrieving a thermal response thereof. The inspection is based in the analysis of the thermal response.
Claims15
A method for inspection of bonding patterns of packages for products, the method comprising:
- feeding a first web material,
- providing a first heated pattern on the first web material,
- feeding a second web material,
- providing a second heated pattern on the second web material,
- routing the first web material and the second web material to a bonding location with the first heated pattern and the second heated pattern facing one another,
- bonding the first web material to the second web material by compression of the first heated pattern against the second heated pattern, thereby defining a bonding pattern at overlapping areas of the first heated pattern and the second heated pattern,
- thermally probing the bonding pattern and the package and detecting a thermal response thereof, the thermal response peaking at the first and second heated patterns as compared to the package, and
- comparing an offset between subsequent peaking locations of the thermal response of the bonding pattern with a reference offset.
5 more elements
Dependencies are inferred from the claim text.