Polyamide moulding composition for extrusion blow moulding
AssigneeEms-Patent AG
InventorsBotho Hoffmann, Oliver Thomas, Minoru Hatta, Takamasa Fujii
Life of this patent
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Abstract
Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-α-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.
Claims35
A thermoplastic moulding composition consisting of:
- (A) 52-67.8 wt % of at least one polyamide elastomer,
- selected from the group consisting of:
- polyetheramide and polyetheresteramide,
- having hard segments selected from the group consisting of:
- PA6, PA66, PA6/66, PA610, PA612, and a combination thereof, and
- having soft segments in the form of OH- or NH2-functionalized polyether segments;
- (B) 18-36 wt % of at least one ethylene-α-olefin copolymer,
- where the α-olefin is selected from the group consisting of:
- but-1-ene, pent-1-ene, hex-1-ene, kept-1-ene and oct-1-ene and a combination thereof,
- and the ethylene-α-olefin copolymer is grafted with at least one system selected from the group consisting of:
- acrylic acid, methacrylic acid, and maleic anhydride,
- where the degree of grafting is 0.9 to 2.0 wt % based on the grafted ethylene-α-olefin copolymer;
- (C) 5-22 wt % of at least one polyamide selected from the group consisting of:
- PA6, PA66, PA6/66, PA610, and PA612;
- wherein the polyamide of component (C) has a relative viscosity of 3.4-4.2, measured according to ISO 307 (2013), in sulfuric acid, 1.0 wt %, 20° C.;
- (D) 0.1 to2.0 wt % of at least one of a heat stabilizer based on copper and/or iodide, lanthanoid compounds, or organic stabilizers;
- (E) 0 to 5.0 wt % of additives, different from (A) to (D);
- where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and
- with the proviso that the sum of (B) and (C) is in the range from 32-45 wt % based on the total moulding composition.
Dependencies are inferred from the claim text.