Laser welding apparatus and laser processing device
AssigneesPanasonic Intellectual Property Management Co., Ltd., Hiroshima Co., Ltd.
InventorsKosuke Inoue, Yuji Kaede, Shu Kumamoto, Hideaki Kunieda
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AssigneesPanasonic Intellectual Property Management Co., Ltd., Hiroshima Co., Ltd.
InventorsKosuke Inoue, Yuji Kaede, Shu Kumamoto, Hideaki Kunieda
Estimating the term…
A first resin member including a first contact surface and formed of laser beam-transmissive resin and a second resin member including a second contact surface, which contacts the first contact surface, and formed of laser beam-absorbing resin are arranged one upon the other. A laser welding apparatus includes a clamping unit abutting the second resin member and applying clamping force to the second resin member, a laser emitter emitting laser beam, a laser controller controlling output of the laser beam, a displacement sensor measuring displacement of the second contact surface in stacking direction of the resin members, and a control unit controlling the clamping unit to adjust the clamping force corresponding to displacement amount of the second contact surface continuously or intermittently obtained from the displacement sensor.
A laser welding apparatus that joins a first resin member, which is formed of a laser beam-transmissive resin and includes a first contact surface, and a second resin member, which is formed of a laser beam-absorbing resin and includes a second contact surface, by melting the first contact surface and the second contact surface with a laser beam in a state in which the first resin member and the second resin member are arranged one upon another with the first contact surface contacting the second contact surface, the laser welding apparatus comprising:
A laser processing device used to laser-weld and join a first resin member, which is formed of a laser beam-transmissive resin and includes a first contact surface, and a second resin member, which is formed of a laser beam-absorbing resin and includes a second contact surface, by melting the first contact surface and the second contact surface with a laser beam in a state in which the first resin member and the second resin member are arranged one upon another with the first contact surface contacting the second contact surface, the laser processing device comprising:
Dependencies are inferred from the claim text.