Repair compound and methods of use
Assignee3M Innovative Properties Company
InventorsJohn E. Gozum, DanLi Wang, Dwight B. Schoenherr
Life of this patent
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Abstract
A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.
Claims15
A repair compound comprising:
- a latex resin or resin binder;
- a thickener;
- hydrophobic fibrillated fibers and hydrophilic fibers;
- and
- a filler material,
- wherein the thickener is a hydrophilic alkali swellable emulsion present in an amount of no greater than about 1% by weight of the total repair compound,
- wherein the hydrophobic fibrillated fibers include polyethylene fibers, the hydrophilic fibers include rayon fibers, or both,
- and wherein the hydrophobic fibrillated fibers have a nominal length and the hydrophilic fibers have a nominal length, and the hydrophobic fibrillated fiber nominal length is less than the hydrophilic fiber nominal length, wherein the repair compound exhibits pseudoplastic behavior and has a density of not greater than 4.0 lbs/gal.
Dependencies are inferred from the claim text.