# US 11,710,914 B2 · Optical module

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- Number: US 11,710,914 B2
- Document ID: US11710914B2
- Status: Granted
- Kind: B2
- Application number: 16/849,474
- Filed: 2020-04-15
- Published: 2020-11-26
- Granted: 2023-07-25
- Earliest claimed: 2019-05-24
- Assignees: Fujitsu Optical Components Limited
- Applicants: Fujitsu Optical Components Limited
- Inventors: Tomonori Azuma; Tetsuo Ishizaka; Koji Otsubo
- Web page: https://patentgrep.com/patent/US11710914B2

## CPC

- G02B 6/4272: {with mounting substrates of high thermal conductivity}
- H01R 12/52: connecting to other rigid printed circuits or like structures
- G02B 6/4269: {with heat sinks or radiation fins}
- G02B 6/4281: {the printed circuit boards being flexible (in general H05K1/147)}
- H01R 12/62: connecting to rigid printed circuits or like structures
- G02B 6/4204: {the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208)}
- G02B 6/4239: {Adhesive bonding; Encapsulation with polymer material}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An optical module includes: a first board having an optical component bonded thereto with an adhesive; a connection structure part rising from the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and a second board joined to the connection structure part.

## Claims

### Claim 1

An optical module comprising:
a first board having an optical component bonded to a first surface with an adhesive and transmitting heat generated by a component mounted on the first surface to a second surface, the optical component constituting a spatial optical system through which an optical signal passes;
a heat dissipating member arranged at a position facing the second surface of the first board and configured to dissipate heat transmitted from the first surface to the second surface of the first board;
a connection structure part rising from the first surface side of the first board and made of a material having lower thermal conductivity than thermal conductivity of a material of the first board; and
a second board joined to the connection structure part.

### Claim 2 (depends on 1)

The optical module according to claim 1, wherein
the first board has a peripheral component mounted thereon, the peripheral component being configured to perform conversion between an optical signal and an electrical signal, and
the connection structure part includes a conductor part that transmits, to the second board, an electrical signal input to or output from the peripheral component.

### Claim 3 (depends on 1)

The optical module according to claim 1, wherein the second board has an electronic component on a position thereof that faces the first board.

### Claim 4 (depends on 1)

The optical module according to claim 1, further comprising a cover member supported by the connection structure part and covering the optical component.

### Claim 5 (depends on 1)

The optical module according to claim 1, further comprising a flexible printed circuit board having flexibility that connects an interconnection disposed on the first board and an interconnection disposed on the second board to each other.

### Claim 6 (depends on 1)

The optical module according to claim 1, further comprising a heat dissipating member making contact with the first board and configured to dissipate heat generated by a component mounted on the first board.

### Claim 7 (depends on 1)

The optical module according to claim 1, wherein the connection structure part is mounted on the second board by reflow soldering.

### Claim 8 (depends on 1)

The optical module according to claim 1, wherein the optical component is mounted with a position error within 1 μm.