Composition for forming organic film, patterning process, and polymer
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaisuke Kori, Takashi Sawamura, Kenta Ishiwata, Takayoshi Nakahara
Life of this patent
Estimating the term…
Loading patent…
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaisuke Kori, Takashi Sawamura, Kenta Ishiwata, Takayoshi Nakahara
Estimating the term…
A composition for forming an organic film contains a polymer having a repeating unit shown by formula (1A) as a partial structure, and an organic solvent, where AR1 and AR2 represent a benzene ring or naphthalene ring optionally with a substituent; W1 represents any in formula (1B), and the polymer optionally contains two or more kinds of W1; W2 represents a divalent organic group having 1 to 80 carbon atoms; R1 represents a monovalent organic group having 1 to 10 carbon atoms and an unsaturated bond; and R2 represents a monovalent organic group having 6 to 20 carbon atoms and one or more aromatic rings. This invention provides: an organic film composition which enables excellent film formability, high etching resistance, and excellent twisting resistance without impairing the resin-derived carbon content, and which contains less outgassing-causing sublimation component; a patterning process using the composition; and a polymer suitable for the composition.
A composition for forming an organic film, comprising:
A composition for forming an organic film, comprising:
A composition for forming an organic film, comprising:
A polymer comprising a repeating unit shown by the following general formula (1A) as a partial structure,
A polymer comprising a repeating unit shown by the following general formula (1A) as a partial structure,
Dependencies are inferred from the claim text.