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US 11,707,230 B2Granted
Pressure sensing implant
AssigneeEndotronix, Inc.
InventorsHarry Rowland, Michael Nagy, Balamurugan Sundaram, Suresh Sundaram
Life of this patent
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Abstract
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Claims16
A method of making a circuit comprising:
- providing a housing that defines a cavity and an opening;
- positioning at least one electrode on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
- positioning at least one electrode on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said first surface;
- bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor;
- and
- inserting at least one electronic assembly within said cavity of said housing;
- bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing wherein the step of bonding said sensor to said opening of said housing is performed prior to inserting at least one electronic assembly within said cavity of said housing.
4 more elements
A method of making a circuit comprising:
- providing a housing that defines a cavity and an opening;
- positioning at least one electrode on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
- positioning at least one electrode on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said first surface;
- bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor;
- inserting at least one electronic assembly within said cavity of said housing;
- bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing;
- and
- tuning said circuit of the at least one electronic assembly within said cavity of said housing after bonding said sensor to said opening of said housing.
5 more elements
A method of making a circuit comprising:
- providing a housing that defines a cavity and an opening;
- positioning at least one capacitive plate on a lid wafer, wherein said lid wafer includes a first surface and an opposite second surface wherein said at least one electrode is positioned on said second surface;
- positioning at least one capacitive plate on a base wafer, wherein said base wafer includes a first surface and an opposite second surface wherein said at least one capacitive plate is positioned on said first surface;
- bonding a portion of said first surface of said base wafer to said second surface of said lid wafer to form said sensor;
- inserting at least one electronic assembly within said cavity of said housing;
- and
- bonding said sensor to said opening of said housing wherein said base wafer is positioned entirely within said cavity defined by said housing.
4 more elements
Dependencies are inferred from the claim text.