Module
AssigneeMurata Manufacturing Co., Ltd.
InventorKoji Furutani
Life of this patent
Estimating the term…
Abstract
A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.
Claims19
A module comprising:
- a substrate having a polygonal shape in a plan view;
- a first electronic component and a second electronic component, the first electronic component and the second electronic component being mounted on one main surface of the substrate;
- and
- side electrodes provided on a plurality of side surfaces forming the polygonal shape of the substrate, wherein
- a first conductor film coupled to the first electronic component and a second conductor film coupled to the second electronic component are provided on the substrate,
- the first conductor film extends to reach a first side surface of the plurality of side surfaces to be coupled to the side electrodes provided on the first side surface, and
- the second conductor film extends to reach a second side surface of the plurality of side surfaces to be coupled to the side electrodes provided on the second side surface, the second side surface being different from the first side surface,
- wherein at least one mounting land is provided on the one main surface, at least one of the first electronic component or the second electronic component being mounted on the at least one mounting land,
- the at least one mounting land includes a mounting land not overlapping a via conductor in the plan view, one end of the via conductor reaching another main surface of the substrate, and
- the mounting land is coupled to the first conductor film or the second conductor film on the one main surface, the first conductor film or the second conductor film being coupled to the at least one of the first electronic component or the second electronic component.
A module comprising:
- a substrate having a polygonal shape in a plan view;
- a first electronic component mounted on one main surface of the substrate;
- and
- side electrodes provided on a plurality of side surfaces forming the polygonal shape of the substrate, wherein
- a first conductor film and a fifth conductor film are provided on the substrate, each of the first conductor film and the fifth conductor film being coupled to the first electronic component,
- the first conductor film extends to reach a first side surface of the plurality of side surfaces to be coupled to the side electrodes provided on the first side surface, and
- the fifth conductor film extends to reach a third side surface of the plurality of side surfaces the third side surface being different from the first side surface.
Dependencies are inferred from the claim text.