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US 11,706,903 B2Granted
Thermal management system
AssigneeBAE SYSTEMS plc
InventorGraham Andrew Holland
Life of this patent
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Abstract
The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.
Claims8
A thermal management system, comprising:
- a fluid coolant;
- a pump;
- a heat exchanger, wherein the heat exchanger comprises an encapsulated phase change material (PCM) through which the fluid coolant passes and a porous feature through which the fluid coolant flows;
- and
- a temperature control unit (TCU) through which the fluid coolant flows after the heat exchanger and before the heat source, the TCU including a controller to activate a TCU heat source to heat the fluid coolant,
- wherein the encapsulated PCM is incorporated as particles suspended in a flow of the fluid coolant, the particles having a size that prevents them from passing through the porous feature.
3 more elements
Dependencies are inferred from the claim text.