Method for manufacturing multilayer wiring substrate

A method for manufacturing a multilayer wiring substrate, comprising:

• forming a resist layer having a mask pattern;
• forming a conductor layer having a conductor pattern using the resist layer having the mask pattern;
• removing the resist layer from the conductor layer having the conductor pattern;
• forming an insulating layer on the conductor layer such that the insulating layer is laminated on the conductor layer having the conductor pattern;
• forming a subsequent resist layer having a mask pattern such that the subsequent resist layer is formed on the insulating layer;
• and
• forming a subsequent conductor layer having a conductor pattern using the subsequent resist layer having the mask pattern,
• wherein the forming of the resist layer includes conducting a first correction in which a formation position of an entire mask pattern of the resist layer is corrected with respect to a reference position, and conducting a second correction in which a shape of the mask pattern of the resist layer is corrected with respect to a reference shape, and the forming of the subsequent resist layer includes conducting the first correction in which a formation position of an entire mask pattern of the subsequent resist layer is corrected with respect to a reference position and does not include conducting the second correction in which a shape of the mask pattern of the subsequent resist layer is corrected with respect to a reference shape.