Hybrid sensor system and method for providing 3D imaging
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang Oh Kim, Yibing Michelle Wang, Radwanul Hasan Siddique, Lilong Shi, Chunji Wang
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsKwang Oh Kim, Yibing Michelle Wang, Radwanul Hasan Siddique, Lilong Shi, Chunji Wang
Estimating the term…
Provided is a 3D depth sensing system and method of providing an image based on a hybrid sensing array. The 3D sensing system including a light source configured to emit light, a hybrid sensing array comprising a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object, a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, and a processing circuit configured to combine 2D image information provided by the 2D sensing region and 3D information provided by the 3D depth sensing region to generate a combined 3D image.
A 3D sensing system comprising:
A method of providing an image based on a hybrid sensing array, the method comprising:
A 3D sensing system comprising:
Dependencies are inferred from the claim text.