Wafer type sensor unit and data acquisition method using the wafer type sensor unit
AssigneeSemes Co., Ltd.
InventorsYong-Jun Seo, Sang Hyun Son, Ji Su Hong, Jae Myoung Lee, Dong Ok Ahn
Life of this patent
Estimating the term…
Abstract
The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
Claims14
A wafer type sensor unit for acquiring data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus,
- the wafer type sensor unit comprising:
- a wafer-shaped circuit board;
- and
- a plurality of hot-wired wind velocity sensors placed apart from each other and positioned 0.55 mm or greater from an upper surface of the circuit board.
A wafer type sensor unit for acquiring data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus, the wafer type sensor unit comprising:
- a wafer-shaped circuit board;
- and
- a coated electronic device installed on an upper surface of the circuit board;
- and
- a plurality of hot-wired wind velocity sensors placed apart from each other and positioned 0.55 mm or greater from the upper surface of the circuit board,
- wherein the height of the plurality of hot-wired wind velocity sensors is constant from the upper surface of the circuit board.
Dependencies are inferred from the claim text.