Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same

Abstract

A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, σ ⁢ ⁢ D × σ ⁢ ⁢ H σ ⁢ ⁢ D + σ ⁢ ⁢ H ≤ 1.0 , where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.

Dependencies are inferred from the claim text.