Circuit module

A circuit module comprising:

• a mounting substrate including a conductor wiring;
• an elastic wave element provided in or on a main surface of the mounting substrate;
• an electric element provided in or on the main surface of the mounting substrate, the electric element being different from the elastic wave element;
• and
• a resin portion provided in or on the main surface of the mounting substrate to cover the elastic wave element and the electric element;
• wherein
• the resin portion is an insulator;
• the elastic wave element and the electric element are directly connected to each other by the conductor wiring and are arranged adjacent to one another;
• a height of the elastic wave element is less than a height of the electric element;
• a thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than a thickness of the resin portion in a region in which the resin portion covers the electric element;
• the elastic wave element includes a piezoelectric substrate and an interdigital transducer (IDT) electrode provided in or on a main surface of the piezoelectric substrate;
• and
• the main surface of the piezoelectric substrate and the main surface of the mounting substrate face each other.