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US 11,700,771 B2Granted
Assembly of piezoelectric material substrate and support substrate, and method for manufacturing said assembly
AssigneeNGK Insulators, Ltd.
InventorsYuji Hori, Takahiro Yamadera, Tatsuro Takagaki
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Abstract
A bonded body includes a supporting substrate, silicon oxide layer provided on the supporting substrate, and a piezoelectric material substrate provided on the silicon oxide layer and composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalite. A nitrogen concentration at an interface between the piezoelectric material substrate and silicon oxide layer is higher than a nitrogen concentration at an interface between the silicon oxide layer and the supporting substrate.
Claims3
A bonded body comprising:
- a supporting substrate;
- a silicon oxide layer provided on said supporting substrate;
- and
- a piezoelectric material substrate provided on said silicon oxide layer, said piezoelectric material substrate comprising a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate,
- wherein a nitrogen concentration at an interface between said piezoelectric material substrate and said silicon oxide layer is higher than a nitrogen concentration at an interface between said silicon oxide layer and said supporting substrate,
- wherein a carbon concentration at said interface between said piezoelectric material substrate and said silicon oxide layer is higher than a non-zero carbon concentration at said interface between said silicon oxide layer and said supporting substrate.
3 more elements
Dependencies are inferred from the claim text.