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US 11,700,744 B2Granted
Encapsulation film including metal layer and protective layer with resin component
AssigneeLG Chem, Ltd.
InventorsKyung Yul Bae, Hyun Jee Yoo, Jung Woo Lee, Se Woo Yang
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Abstract
The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.
Claims16
An encapsulation film comprising an encapsulation layer, a metal layer and a protective layer,
- wherein the protective layer has a thickness of more than 5 μm and comprises a resin component,
- wherein a glass transition temperature of the resin component after curing is 0° C. or higher, the glass transition temperature measured after curing the encapsulation film by heating at a temperature in a range of 50 to 300° C.;
- by irradiating ultraviolet ray;
- or by both, and
- wherein the resin component is a thermosetting resin, a photo-curing resin or a dual curing resin, comprises a curable oligomer and a curable monomer, and comprises an epoxy resin having a cyclic structure in addition to the epoxy group in its molecular structure.
2 more elements
Dependencies are inferred from the claim text.