Memory device
AssigneeShannon Systems Ltd.
InventorJiangshan Li
Life of this patent
Estimating the term…
Abstract
A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.
Claims13
A memory device, comprising:
- a device housing;
- a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing;
- and
- a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
- a unit housing, wherein an interior space is formed in the unit housing;
- and
- a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid,
- wherein the interior space comprises a flow path, the cooling unit comprises a fluid inlet and a fluid outlet, the fluid inlet is connected to one end of the flow path, the fluid outlet is connected to the other end of the flow path, and the working fluid enters the flow path via the fluid inlet and leaves the flow path via the fluid outlet to remove the heat from the cooling unit.
A memory device, comprising:
- a device housing;
- a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing;
- and
- a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
- a unit housing, wherein an interior space is formed in the unit housing;
- a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid;
- and
- a heat conductive material, wherein the device housing is connected to the unit housing by wedging or screw, and the heat conductive material is disposed between the device housing and the unit housing.
A memory device, comprising:
- a device housing;
- a memory module, disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing;
- and
- a cooling unit, thermally connected to the device housing to dissipate a part of the heat, wherein the cooling unit comprises:
- a unit housing, wherein an interior space is formed in the unit housing;
- a working fluid, disposed in the interior space, wherein a part of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid,
- wherein a plurality of unit housing ribs are formed on a surface of the unit housing,
- wherein the device housing further comprises an air inlet and an air outlet, air flow passes through the air inlet and the air outlet in a first direction, and the unit housing ribs extend in the first direction.
Dependencies are inferred from the claim text.