Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule

A component carrier, comprising:

• a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
• a tapering blind hole formed in the stack;
• and
• an electrically conductive plating layer extending along at least part of a horizontal surface of the stack outside of the blind hole and along at least part of a surface of the blind hole;
• wherein a minimum thickness of the plating layer at a bottom of the blind hole is at least 8 μm,
• wherein a demarcation surface of the plating layer in the blind hole and facing away from the stack extends laterally outwardly from the bottom of the blind hole towards a lateral indentation and then extends laterally inwardly from the indentation up to an outer end of the blind hole,
• wherein an electrically conductive structure filling at least part of a volume between the plating layer and an exterior of the blind hole.