Circuit board

A circuit board, comprising:

• a first layer for using as a first reference voltage plane;
• a second layer for using as a second reference voltage plane;
• a plurality of transmission wires are disposed on a third layer, wherein the first ends of the plurality of transmission wires are coupled to a wireless signal transceiver, and the second ends of the plurality of transmission wires are coupled to a plurality of antenna arrays;
• wherein the third layer is disposed between the first layer and the second layer;
• a plurality of plating through holes, disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane;
• and
• at least one first intermediate layer and at least one second intermediate layer, wherein the at least one first intermediate layer is disposed between the first layer and the third layer, and the at least one second intermediate layer is disposed between the second layer and the third layer, wherein the at least one first intermediate layer has a first area corresponding to a first vertical projection surface of the transmission wires, the first area includes non-conductive materials, the at least one second intermediate layer has a second area corresponding to a second vertical projection surface of the transmission wires, and the second area includes non-conductive materials, wherein a width of each of the transmission wires is set to 3.5 ml or larger, each of the transmission wires is configured to transmit an intermediate frequency signal, and a total conductive loss of each of the transmission wires is smaller than 5.2 dB when a transmitted signal is at 10 G hertz.