Guard ring in cavity PCB
AssigneeKnowles Electronics, LLC
InventorFei Ding
Life of this patent
Estimating the term…
Abstract
A microphone assembly including an acoustic transducer configured to generate an electrical signal responsive to acoustic activity, an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity, a cover, and a substrate. The substrate including a first surface and a second surface to which the cover is coupled. The second surface is disposed at a perimeter of the substrate and the first surface is raised with respect to the second surface. The cover is coupled to the substrate to form a housing in which the transducer and the integrated circuit are disposed.
Claims20
A microphone assembly comprising:
- an acoustic transducer configured to generate an electrical signal responsive to acoustic activity;
- an integrated circuit electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity;
- a cover;
- and
- a substrate comprising a first surface and a second surface to which the cover is coupled, wherein the second surface is disposed at a perimeter of the substrate and the first surface is raised with respect to the second surface,
- wherein the cover is coupled to the substrate to form a housing in which the acoustic transducer and the integrated circuit are disposed,
- wherein the first surface extends across a planar layer and the acoustic transducer and the integrated circuit are both mounted on the first surface.
A microphone assembly substrate comprising:
- a first surface defined by a first layer;
- a second surface defined by a second layer and disposed around a perimeter of the microphone assembly substrate, wherein the first surface is raised relative to the second surface;
- a third surface defined by a third layer;
- and
- a conductive trace on the first surface and extending to the third surface, the conductive trace facilitating electrical signal transmission from a component mounted on the first surface to a device external the microphone assembly substrate,
- wherein an acoustic transducer and an integrated circuit are both mounted on the first surface.
Dependencies are inferred from the claim text.