Oscillator and method of manufacturing same
AssigneeSeiko Epson Corporation
InventorsShoichiro Kasahara, Shinya Aoki
Life of this patent
Estimating the term…
Abstract
An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.
Claims10
An oscillator comprising:
- a package having a plurality of external terminals disposed on a mounting surface, the package being in a rectangular shape in a plan view and having a first side, a second side as an opposite side to the first side, a third side, and a fourth side as an opposite side to the third side in the plan view;
- a circuit element housed in the package, the circuit element being in a rectangular shape in the plan view and having a fifth side located beside the first side, a sixth side which is an opposite side to the fifth side, and is located farther from the first side than the fifth side, a seventh side, and an eighth side as an opposite side to the seventh side in the plan view;
- and
- a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein
- the circuit element is electrically coupled to the package with a plurality of pads which are bonded to the package via a plurality of bump members, respectively,
- the circuit element overlaps at least one of the plurality of external terminals in the plan view,
- each of the plurality of bump members is bonded to the package at a position where at least a part of the plurality of bump members does not overlap the plurality of external terminals in the plan view,
- the plurality of pads includes a first pad group disposed along the fifth side so as to be closer to the fifth side than to the sixth side, and a second pad group disposed along the sixth side so as to be closer to the sixth side than to the fifth side,
- a distance between the first side and the fifth side is longer than a distance between the second side and the sixth side, and
- a distance between the sixth side and the second pad group is longer than a distance between the fifth side and the first pad group.
A method of manufacturing an oscillator, the oscillator including,
- a package having a plurality of external terminals disposed on a mounting surface, the package being in a rectangular shape in a plan view and having a first side, a second side as an opposite side to the first side, a third side, and a fourth side as an opposite side to the third side in the plan view;
- a circuit element housed in the package, the circuit element being in a rectangular shape in the plan view and having a fifth side located beside the first side, a sixth side which is an opposite side to the fifth side, and is located farther from the first side than the fifth side, a seventh side, and an eighth side as an opposite side to the seventh side in the plan view, the circuit element overlapping at least one of the plurality of external terminals in the plan view;
- and
- a resonator which is housed in the package, and is electrically coupled to the circuit element,
- the method comprising:
- a bonding step of bonding each of a plurality of pads provided at the circuit element to the package via a plurality of bump members, respectively, thereby electrically couple the circuit element to the package, wherein
- in the bonding step, each of the plurality of bump members is located so that at least a part of the plurality of bump members does not overlap the plurality of external terminals in the plan view,
- the plurality of pads includes a first pad group disposed along the fifth side so as to be closer to the fifth side than to the sixth side, and a second pad group disposed along the sixth side so as to be closer to the sixth side than to the fifth side,
- a distance between the first side and the fifth side is longer than a distance between the second side and the sixth side, and
- a distance between the sixth side and the second pad group is longer than a distance between the fifth side and the first pad group.
Dependencies are inferred from the claim text.