Electromagnetic shielding of heatsinks with spring press-fit pins

An apparatus comprising:

• a printed circuit board, a logic chip, a heatsink, and a grounding member, wherein the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member;
• the logic chip electrically coupled to the printed circuit board;
• the heatsink disposed on a top surface of the logic chip;
• a thermal interface material disposed between the top surface of the logic chip and a bottom surface of the heatsink;
• the first terminal pin at the first end of the grounding member disposed in a plated-through hole of the printed circuit board, wherein the grounding member electrically couples the heatsink to the printed circuit board;
• and
• a load bar of the grounding member translates a load applied to the heatsink during an assembly process to the integrated spring and the first terminal pin;
• the integrated spring of the grounding member presses a second end of the grounding member against the bottom surface of the heatsink, wherein the second end of the grounding member electrically couples the heatsink to the grounding member.