Array substrate and preparation method thereof, and digital microfluidic chip
AssigneesBeijing BOE Sensor Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorsXue Dong, Yue Geng, Peizhi Cai
Life of this patent
Estimating the term…
Abstract
Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.
Claims7
A preparation method of an array substrate applied to a digital microfluidic chip, comprising:
- forming a plurality of photoelectric detection devices on a silicon-based substrate;
- transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process;
- and
- forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices;
- wherein the forming a plurality of transparent driving electrodes on the base substrate comprises:
- forming the plurality of transparent driving electrodes at sides of the photoelectric detection devices facing away from the base substrate after the photoelectric detection devices are transferred to the base substrate;
- wherein the forming a plurality of photoelectric detection devices on a silicon-based substrate comprises:
- forming a photoelectric conversion film layer and a first electrode layer on a first silicon-based substrate sequentially;
- patterning the first electrode layer to form patterns of a plurality of first electrodes;
- forming patterns of a plurality of conductive bonding layers on a second silicon-based substrate, wherein the plurality of conductive bonding layers respectively correspond to the first electrodes;
- aligning and bonding a side of the first silicon-based substrate provided with the first electrodes and a side of the second silicon-based substrate provided with the conductive bonding layers, and removing the first silicon-based substrate;
- and patterning the photoelectric conversion film layer to form a plurality of photoelectric conversion units.
Dependencies are inferred from the claim text.