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US 11,699,757 B2Granted
High dose implantation for ultrathin semiconductor-on-insulator substrates
AssigneeSTMicroelectronics S.r.l.
InventorJocelyne Gimbert
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Abstract
Methods and structures for forming highly-doped, ultrathin layers for transistors formed in semiconductor-on-insulator substrates are described. High dopant concentrations may be achieved in ultrathin semiconductor layers to improve device characteristics. Ion implantation at elevated temperatures may mitigate defect formation for stoichiometric dopant concentrations up to about 30%. In-plane stressors may be formed adjacent to channels of transistors formed in ultrathin semiconductor layers.
Claims10
A device, comprising:
- a substrate;
- an insulating layer on the substrate;
- an ultrathin semiconductor layer on the insulating layer, the ultrathin semiconductor layer having a first surface and a second surface opposite the first surface, the ultrathin semiconductor layer including:
- a first portion including a conductivity dopant between the first and second surface of the ultrathin semiconductor layer, the first portion having a first doping level;
- a second portion laterally adjacent to the first portion and including the conductivity dopant between the first and second surface of the ultrathin semiconductor layer, the second portion having a second doping level that is different than the first doping level;
- and
- a third portion laterally adjacent to the first portion and including the conductivity dopant between the first and second surface of the ultrathin semiconductor layer, the first portion being between the second portion and the third portion, the third portion having a third doping level that is different than the first doping level;
- and
- a transistor on the ultrathin semiconductor layer, the transistor including a channel that is at least a part of the first portion of the ultrathin semiconductor layer,
- wherein the ultrathin semiconductor layer includes gallium and the conductivity dopant includes nitrogen.
7 more elements
A device, comprising:
- a substrate;
- an insulating layer on the substrate;
- an ultrathin semiconductor layer on the insulating layer, the ultrathin semiconductor layer having a first surface and a second surface opposite the first surface, the ultrathin semiconductor layer including:
- a channel region including a conductivity dopant implanted between the first and second surface of the ultrathin semiconductor layer, the conductivity dopant only being present in the channel region;
- a first portion laterally adjacent to the channel region;
- and
- a second portion laterally adjacent to the channel region, the channel region being between the first portion and the second portion;
- and
- a gate structure on the channel region of the ultrathin semiconductor layer,
- wherein the first portion and the second portion have a same dimension between the first surface and the second surface as the channel region, and
- wherein the channel region includes indium gallium nitride.
8 more elements
Dependencies are inferred from the claim text.