Semiconductor image sensor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Chieh Chiang, Keng-Yu Chou, Chun-Hao Chuang, Wen-Hau Wu, Jhy-Jyi Sze, Chien-Hsien Tseng, Kazuaki Hashimoto
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Abstract
A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, and a color filter disposed over the pixel sensor. The pixel sensor includes a plurality of first micro structures disposed over the back side of the substrate. The color filter includes a plurality of second micro structures disposed over the back side of the substrate. The first micro structures are arranged symmetrically to a first axial, and the second micro structures are arranged symmetrically to a second axial.
Claims20
A back side illumination (BSI) image sensor comprising:
- a substrate comprising a front side and a back side opposite to the front side;
- a pixel sensor disposed in the substrate;
- and the pixel sensor comprising a plurality of first micro structures disposed over the back side of the substrate;
- and
- a color filter disposed over the pixel sensor, and the color filter comprising a plurality of second micro structures disposed over the back side of the substrate,
- wherein the first micro structures are arranged symmetrically to a first axial, and the second micro structures are arranged symmetrically to a second axial.
A back side illumination (BSI) image sensor comprising:
- a substrate comprising a front side and a back side opposite to the front side;
- a pixel sensor disposed in the substrate;
- and the pixel sensor comprising a plurality of first micro structures disposed over the back side of the substrate;
- and
- a color filter disposed over the pixel sensor, and the color filter comprising a plurality of second micro structures disposed over the back side of the substrate,
- wherein each of the first micro structures is different from each of the second micro structures.
A back side illumination (BSI) image sensor comprising:
- a substrate comprising a front side and a back side opposite to the front side;
- a photodiode disposed in the substrate;
- a color filter disposed over the back side of the substrate;
- a plurality of first micro structures disposed between the photodiode and the color filter;
- a plurality of second micro structures disposed over the front side of the substrate;
- and
- a dielectric layer disposed between adjacent second micro structures,
- where a surface of the dielectric layer and surfaces of the second micro structures form a flat surface over the front side of the substrate.
Dependencies are inferred from the claim text.