US 11,699,692 B2Granted

Semiconductor device and method for manufacturing same

AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation

InventorTakamitsu Noda

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Abstract

A semiconductor device includes a first switching element, a second switching element, an optical coupling element, a plurality of leads and an outer resin member. The first switching element includes a first semiconductor chip and a first inner resin member sealing the first semiconductor chip. The second switching element includes a second semiconductor chip and a second inner resin member sealing the second semiconductor chip. The optical coupling element includes a light-emitting element, a light-receiving element and a third inner resin member sealing the light-emitting element and the light-receiving element. The first and second switching element and the optical coupling element are provided with terminals projecting from the first to third inner resin member, and the plurality of leads are electrically connected to the terminals. The outer resin member seals the first and second switching elements, the optical coupling element, and the plurality of leads.

Claims15

Dependent claims

A semiconductor device, the device comprising:

a first switching element including a first semiconductor chip, a first inner resin member, first and second terminals and a first control terminal,
the first semiconductor chip including a first electrode, a second electrode, and a first control electrode,
the first inner resin member sealing the first semiconductor chip,
the first terminal being electrically connected to the first electrode, the first terminal projecting from the first inner resin member,
the second terminal being electrically connected to the second electrode, the second terminal projecting from the first inner resin member,
the first control terminal being electrically connected to the first control electrode, the first control terminal projecting from the first inner resin member;
a second switching element including a second semiconductor chip, a second inner resin member, third and fourth terminals and a second control terminal,
the second semiconductor chip including a third electrode, a fourth electrode, and a second control electrode,
the second inner resin member sealing the second semiconductor chip,
the third terminal being electrically connected to the third electrode, the third terminal projecting from the second inner resin member,
the fourth terminal being electrically connected to the fourth electrode, the fourth terminal projecting from the second inner resin member,
the second control terminal being electrically connected to the second control electrode, the second control terminal projecting from the second inner resin member;
an optical coupling element including a light-emitting element, a light-receiving element, a third inner resin member, an input terminal and first and second output terminals,
the light-receiving element being arranged to receive a light emission of the light-emitting element,
the third inner resin member sealing the light-emitting element and the light-receiving element,
the input terminal being electrically connected to the light-emitting element, the input terminal projecting from the third inner resin member, and
the first and second output terminals being electrically connected to the light-receiving element, the first and second output terminals projecting from the third inner resin member;
a plurality of leads electrically connected to the first to fourth terminals, the first and second control terminals, the input terminal, and the first and second output terminals;
and
an outer resin member sealing the first and second switching elements, the optical coupling element, and the plurality of leads.

17 more elements

A method for manufacturing a semiconductor device, the method comprising:

mounting a first switching element on a leadframe,
the first switching element including a first semiconductor chip, first and second terminals, a first control terminal and a first resin member,
the first semiconductor chip including first and second electrodes and a first control electrode, the first terminal being electrically connected to the first electrode, the second terminal being electrically connected to the second electrode, the first control terminal being electrically connected to the first control electrode,
the first resin member sealing the first semiconductor chip, the first and second terminals and the first control terminal projecting from the first resin member,
the leadframe including a frame, first to third leads and a control lead, the first to third leads being linked to the frame via first suspension pins, the control lead being linked to the third lead via a second suspension pin,
the first switching element being mounted on the leadframe by connecting a first terminal to the first lead, connecting a second terminal to the third lead, and connecting a first control terminal to the control lead;
mounting a second switching element on the leadframe,
the second switching element including a second semiconductor chip, third and fourth terminals, a second control terminal and a second resin member,
the second semiconductor chip including third and fourth electrodes and a second control electrode, the third terminal being electrically connected to the third electrode, the fourth terminal being electrically connected to the fourth electrode, the second control terminal being electrically connected to the second control electrode,
the second resin member sealing the second semiconductor chip, the third and fourth terminals and the second control terminal projecting from the second resin member,
the second switching element being mounted on the leadframe by connecting the third terminal to the second lead, connecting the fourth terminal to the third lead, and connecting the second control terminal to the control lead;
cutting the second suspension pin that links the control lead and the third lead after the mounting of the first and second switching elements on the leadframe;
and
molding an outer resin member that seals the first switching element, the second switching element, the first to third leads and the control lead after the cutting of the second suspension pin that links the control lead and the third lead.

11 more elements

A semiconductor device, comprising:

a first switching element including a first terminal, a second terminal, and a first control terminal controlling a current flowing between the first terminal and the second terminal;
a second switching element including a third terminal, a fourth terminal, and a second control terminal controlling a current flowing between the third terminal and the fourth terminal;
an optical coupling element including a light-emitting element, a light-receiving element receiving a light emission of the light-emitting element, an input terminal electrically connected to the light-emitting element, and an output terminal outputting an output signal of the light-receiving element when the light-receiving element receives an optical signal output from the light-emitting element;
a first lead connected to the first terminal;
a second lead connected to the third terminal;
a third lead connected to the input terminal of the optical coupling element;
a fourth lead connected to the second and fourth terminals;
a fifth lead connected to the first control terminal, the second control terminal, and the output terminal of the optical coupling element;
and
a resin member that covers the first switching element, the second switching element, the optical coupling element, and the first to fifth leads so that the fourth and fifth leads are not exposed, and at least portions of the first to third leads project outside the resin member.

7 more elements

Dependencies are inferred from the claim text.