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US 11,699,691 B2Granted
Interposer frame and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorJiun Yi Wu
Life of this patent
Estimating the term…
Abstract
Some embodiments relate to a package. The package includes a first substrate, a second substrate, and an interposer frame between the first and second substrates. The first substrate has a first connection pad disposed on a first face thereof, and the second substrate has a second connection pad disposed on a second face thereof. The interposer frame is arranged between the first and second faces and generally separates the first substrate from the second substrate. The interposer frame includes a plurality of through substrate holes (TSHs) which pass entirely through the interposer frame. A TSH is aligned with the first and second connection pads, and solder extends through the TSH to electrically connect the first connection pad to the second connection pad.
Claims20
A package comprising:
- a first substrate having a first connection pad disposed on a first face of the first substrate;
- a second substrate having a second connection pad disposed on a second face of the second substrate, the second substrate being spaced apart from the first substrate;
- an interposer frame arranged between the first substrate and the second substrate, the interposer frame comprising:
- an interposer substrate having a plurality of through substrate holes (TSHs) and having an opening whose width is greater than a width of each TSH of the plurality of TSHs, wherein the interposer substrate is made of a base material and at least one additive and the at least one additive adjusts a strength and a coefficient of thermal expansion of the interposer substrate;
- and
- a conductive layer lining sidewalls of each TSH of the plurality of TSHs, the conductive layer filling less than an entirety of each TSH, wherein the conductive layer comprises a first metal on the sidewalls of each TSH, a second metal, different from the first metal, on an upper surface of the interposer substrate around each TSH, and a third metal on sidewalls of the first metal in each TSH and on an upper surface of the second metal around each TSH;
- and
- solder extending entirely through the TSHs and along inner sidewalls of the conductive layer to electrically connect the first connection pad to the second connection pad.
5 more elements
A package including an interposer frame, the interposer frame comprising:
- an interposer substrate having a plurality of through substrate holes (TSHs) and having an opening whose width is greater than a width of each TSH of the plurality of TSHs, wherein the interposer substrate has upper and lower surfaces and is made of a base material and fiber glass and the fiber glass adjusts a strength and a coefficient of thermal expansion of the interposer substrate, wherein the base material and the fiber glass are continuous from the upper surface to the lower surface, wherein a weight percentage of the fiber glass from the upper surface to the lower surface of the interposer substrate is in a range from 5% to 60%;
- and
- a conductive layer lining sidewalls of each TSH of the plurality of TSHs, the conductive layer filling less than an entirety of each TSH, and where the conductive layer includes an upper collar extending out of a TSH to over the upper surface of the interposer substrate proximate to the TSH and includes a lower collar extending out of the TSH to beneath the lower surface of the interposer substrate proximate to the TSH, wherein the upper collar and the lower collar comprise a first metal along sidewalls of the TSH and a second metal, different from the first metal, along the upper surface and the lower surface of the interposer substrate.
A package, comprising:
- a first substrate comprising a first plurality of connectors;
- and
- a second substrate disposed spaced apart from the first substrate;
- an interposer frame disposed between the first substrate and the second substrate, the interposer frame comprising:
- an interposer substrate having a plurality of through substrate holes (TSHs) which are aligned with the first plurality of connectors, respectively, and having a central die opening laterally surrounded by the plurality of TSHs and whose width is greater than a width of each TSH of the plurality of TSHs;
- a plurality of conductive ring-like structures lining sidewalls of the plurality of TSHs, respectively, such that a conductive ring-like structure fills less than an entirety of a corresponding TSH and leaves a central opening extending entirely through the conductive ring-like structure;
- and
- a molding compound extending beneath a lower surface of the interposer substrate to vertically separate the lower surface of the interposer substrate from the second substrate, and wherein the molding compound has an upper surface that is level with or beneath the upper surface of the interposer substrate such that the molding compound does not vertically separate the upper surface of the interposer substrate from the first substrate.
5 more elements
Dependencies are inferred from the claim text.