Non-cure and cure hybrid film-on-die for embedded controller die
AssigneeWestern Digital Technologies, Inc.
InventorsLing Yang, Hui Xu, Chong Un Tan
Life of this patent
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Abstract
A semiconductor assembly includes a first die and a second die. The semiconductor assembly also includes a film on die (FOD) layer configured to attach the first die to the second die. The FOD layer is disposed on a first surface of the first die. The FOD layer includes a first portion comprising a first die attach film (DAF) disposed on an inner region of the first surface. The FOD layer also includes a second portion that includes a second DAF disposed on a peripheral region of the first surface surrounding the inner region. The second DAF includes a different material than the first DAF.
Claims20
A semiconductor assembly, comprising:
- a first die;
- a second die;
- a film on die (FOD) layer configured to attach the first die to the second die, the FOD layer being disposed on a first surface of the first die and comprising:
- a first portion comprising a first die attach film (DAF) disposed on an inner region of the first surface;
- and
- a second portion comprising a second DAF disposed on a peripheral region of the first surface surrounding the inner region, the second DAF comprising a different material than the first DAF.
A method for manufacturing a film on die (FOD), comprising:
- forming a first portion of the FOD using a first mask, wherein the first portion comprises a first type of die attach film (DAF), the first mask indicating a size and shape of the first portion;
- forming a second portion of the FOD using a second mask, wherein the second portion comprises a second type of DAF, the second mask indicating a size and shape of the second portion;
- and
- assembling the first portion and the second portion to form the FOD, such that the first portion is surrounded by the second portion.
A semiconductor assembly, comprising:
- a first die means for storing data;
- a second die means for controlling the first die means;
- a film means for attaching the first die means to the second die means, the second die means being embedded in the film means, the film means comprising a first portion and a second portion, wherein the first portion comprises a first type of die attach film (DAF), and the second portion comprises a second type of DAF, wherein the first portion is surrounded by the second portion.
Dependencies are inferred from the claim text.