Semiconductor package including heat dissipation layer
AssigneeSK hynix Inc.
InventorJoo Wan Hong
Life of this patent
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Abstract
A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.
Claims16
A semiconductor package comprising:
- an interposer including first and second surfaces opposite to each other;
- a heat dissipation layer disposed on the first surface of the interposer;
- a first semiconductor die mounted on the first surface of the interposer;
- a stack of second semiconductor dies mounted on the second surface of the interposer;
- and
- a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer,
- wherein the interposer further includes a passivation layer exposing a surface of the heat dissipation layer on the first surface of the interposer.
A semiconductor package comprising:
- an interposer including first and second surfaces opposite to each other;
- a heat dissipation layer disposed on the first surface of the interposer;
- a first semiconductor die mounted on the first surface of the interposer;
- a stack of second semiconductor dies mounted on the second surface of the interposer;
- and
- a thermally conductive connection part comprising:
- a thermally conductive via penetrating through the interposer to thermally connect with the heat dissipation layer disposed on the first surface of the interposer;
- and
- a thermally conductive connector thermally connecting the thermally conductive via to the stack of second semiconductor dies mounted on the second surface of the interposer,
- wherein the interposer further includes a passivation layer exposing a surface of the heat dissipation layer on the first surface of the interposer.
Dependencies are inferred from the claim text.