Die-to-wafer bonding utilizing micro-transfer printing

A method comprising:

• transferring, by micro-transfer printing, a plurality of die from a source wafer onto an intermediate handle wafer comprising a substrate coated with an adhesive layer to create an intermediate handle wafer structure including the plurality of die, wherein the source wafer comprises a top layer of tether material from which the plurality of die are suspended, and wherein transferring the plurality of die comprises picking the plurality of die from the source wafer and placing the plurality of die onto the adhesive layer of the intermediate handle wafer using a micro-transfer printing stamp brought in contact with the tether material at locations of the plurality of die;
• bonding the intermediate handle wafer structure die-down onto a target wafer, the bonding comprising plasma-activating at least one of bonding surfaces of the plurality of die or a bonding surface of the target wafer, and placing the intermediate handle wafer structure die-down onto the target wafer to cause formation of an initial bond between the plurality of die and the target wafer;
• and removing the substrate and the adhesive layer of the intermediate handle water, leaving the plurality of die bonded to the target wafer.