Multi-beam laser de-bonding apparatus and method thereof

A multi-beam laser debonding apparatus for debonding a target electronic component from a substrate, the apparatus comprising:

• a first laser module configured to
• emit a first laser beam to a first substrate area including attachment positions of the target electronic component and a neighboring electronic component around the target electronic component, and
• heat solders of the target electronic component and the neighboring electronic component within the first substrate area to reach a predetermined pre-heat temperature;
• and
• a second laser module configured to
• emit a second laser beam to a second substrate area smaller than the first substrate area to overlap the first laser beam, the second substrate area including only the attachment position of the target electronic component, and
• heat the solder of the target electronic component to reach, from the preheated temperature, a debonding temperature at which the solder commences melting,
• wherein the output power of the second laser beam is lower than the output power of the first laser beam, and
• wherein the first laser module and the second laser module have an emission surface having a quadrangular, and wherein the first and second laser modules are arranged in a symmetrical manner, have an equal beam emission angle, and have different wavelengths from one another.