Semiconductor package and method of forming the same

A semiconductor device comprising:

• a substrate;
• a package attached to an upper surface of the substrate;
• a ring around the package and attached to the upper surface of the substrate, wherein the ring comprises corner portions and edge portions connecting the corner portions;
• and
• an adhesive material between the substrate and the ring, wherein the adhesive material comprises discrete portions disposed between the edge portions of the ring and the substrate, wherein a first plurality of openings are disposed between the corner portions of the ring and the substrate.

A semiconductor device comprising:

• a substrate;
• a package attached to an upper surface of the substrate;
• an underfill material between the package and the substrate;
• a ring around the package and attached to the upper surface of the substrate, wherein the ring comprises corner portions and edge portions connecting the corner portions, wherein the ring is spaced apart from the underfill material;
• and
• an adhesive between the substrate and the ring, wherein the adhesive comprises:
• a first adhesive material between the corner portions of the ring and the substrate;
• and
• a second adhesive material between the edge portions of ring and the substrate, wherein the first adhesive material is different from the second adhesive material.