Semiconductor package having varying conductive pad sizes
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Hao Lin, Chien-Kuo Chang, Tzu-Kai Lan, Chung-Chih Chen, Jr-Lin Hsu
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Abstract
A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.
Claims20
A semiconductor package, comprising:
- a package component having a non-planar surface;
- and
- a plurality of conductive features formed on the non-planar surface of the package component;
- wherein the conductive features comprise a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface, and wherein a height of the first position is less than a height of the second position, and a size of the first conductive feature is smaller than a size of the second conductive feature.
A semiconductor package, comprising:
- a package component having a non-planar surface;
- a plurality of conductive features on the non-planar surface of the package component, wherein the conductive features are arranged in different positions of the non-coplanar surface with different heights;
- and
- a plurality of conductive connectors formed on the conductive features, wherein the conductive connectors have different heights, and wherein taller conductive connectors of the plurality of conductive connectors are formed on the conductive features arranged in lower positions of the non-coplanar surface, and shorter conductive connectors of the plurality of conductive connectors are formed on the conductive features arranged in higher positions of the non-coplanar surface.
A semiconductor package, comprising:
- a package component having a non-planar surface, wherein the non-planar surface has a first region and a second region with different heights;
- and
- a plurality of conductive features on the non-planar surface;
- wherein the conductive features have different areas, and wherein larger-sized conductive features of the plurality of conductive features are arranged in the first region of the non-planar surface having a greater height, and smaller-sized conductive features of the plurality of conductive features are arranged in the second region of the non-planar surface having a lower height.
Dependencies are inferred from the claim text.